Below you can download the catalogue in PDF with all the products SILCOR 100, 200 and 501.
SILCOR 200 is a thickness silver plating process used both for intermediate depositions between two platings and for electroforming due to the particular hardness of the deposit provided by inorganic additives added to the brightener.
SILCOR 501 is a cyanide-free electroplating silver plating process that allows the deposition of an extremely white layer of silver. The special features of this process are the electrolytic stability and the high quality of the deposit in total absence of cyanides in solution. SILCOR 501 can be applied directly on silver and gold, or, through a special pre-treatment, even on nickel and copper alloys.